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第5章
SiP与先进封装技术

关键词:基板,有机基板,刚性有机基板,刚柔结合板,塑封SiP,陶瓷基板,HTCC,LTCC,氮化铝,硅基板,TSV,Via-First,Via-Last,RDL,IPD,Chiplet,FOWLP,WLP,CSP,WLCSP,Fan-in,Fan-out,FOPLP,InFO,CoWoS,HBM,HMC,Wide-IO,EMIB,Foveros,Co-EMIB,3D IC,SoIC,X-Cube,先进封装四要素